UL Test Capabilities

UL94 – Flammability of Plastics Materials

• 94HB Horizontal Burning Test
• 94V-0, V-1, or V-2 Veritical Burning Testing
• HBF, HF-1, HF-2 Horizontal Buring Foamed Materials
• VTM-0, VTM-1, or VTM-2 Thin Material Vertical Burning Test

UL 746A – Polymeric Materials – Short Term Property Evaluations

• Ash Content
• Comparative Tracking Index (CTI)
• Deflection Temperature of Polymeric Materials Under Load
• Dielectric Breakdown and Voltage Strength
• Flexural Strength
• Glow Wire Ignitability (GWI)
• High Current Arc Ignition (HAI)
• High Voltage Arc Resistance (HVAR)
• High Voltage Arc Tracking Rate Resistance (HVTR)
• High Voltage, Low Current Dry Arc Resistance (D495)
• Hot Wire Ignition (HWI)
• IZOD Impact Strength
• Moisture Absorption
• Specific Gravity of Polymers
• Tensile Impact
• Tensile Strength of Thermoplastic Polymeric Materials
• Tensile Strength of Thin Polymeric Sheeting
• Vicat Softening Point for Polymeric Materials
• Volume and Surface Resistivity

UL 746B – Polymeric Materials – Long Term Property Evaluations

• Relative Thermal Index Based Long Term Thermal Aging (LTTA)

UL 746E – Polymeric Materials – Industrial Laminates, Filament Wound Tubing, Vulcanized FIber and Materials used in Printed Wiring Boards

• Bond Strength
• Delamination and Blistering
• Dissimilar Dielectric Materials Thermal Cycling
• Flammability: Metal Clad Laminates and Permanent Coatings
• Microsectional Analysis
• Thermal Shock

UL 746F – Polymeric Materials – Flexible Dielectric Film Materials for use in Printed Wiring Boards and Flexible Materials Interconnect Constructions

• Ambient Bend
• Bond Strength
• Cold Bend
• Cover Layer
• Delamination
• Flammability
• Microsectional Analysis
• Repeated Flexing
• Thermal Shock

UL 796 – Printed Wiring Boards

• Blistering
• Bond Strength
• Delamination
• Flammability
• Thermal Cycling

UL 796F – Flexible Materials Interconnect Constructions

• Ambient Bend
• Bond Strength
• Conductive Paste Adhesion
• Cover Layer
• Cold Bend
• Delamination
• Dissimilar Dielectric Materials
• Thermal Cycling
• Plating Adhesion
• Repeated Flexing
• Silver Migration
• Stiffener Bond Strength
• Thermal Shock

UL Subject 5703 – Outline of Investigation for Determination of the Maximum Operating Temperature Rating of Photovoltaic (PV) Materials

Short Term Aging and Pre-Screen Testing

ZPMV2 – Wiring, Printed – Component (Rigid PCB’s)

ZPXK2 – Wiring, Printed-Flexible Material Constructions – Component (Flexible and Flex-Rigid PCB’s)

QMTS2 – Polymeric Materials – Filament-wound Tubing, Industrial Laminates, Vulcanized Fibers, and Materials for Use in Fabricating Recognized Printed Wiring Boards – Component

QMJU2 – Coatings for Use on Recognized Printed Wiring Boards – Component (solder masks)

QMFZ2 – Plastics – Component

OCDT2 – Insulating Devices and Materials, Miscellaneous – Component

For additional information or to start our UL test program with GVIRL, contact us today.